Boğaziçi CT3

Device Name / Brand / Model
• Name: Sputter Coating System (PVD – Sputtering)
• Brand: VAKSİS
• Model: ANGORA

Overview
The VAKSİS ANGORA is a thin-film coating system based on sputtering, one of the Physical Vapor Deposition (PVD) methods. It enables surface coating using a range of target materials such as copper, chromium, nickel, silicon, silicon dioxide, titanium, and tantalum. With 4-inch wafer compatibility, RF/DC bias options, substrate heating/cooling, and rotation, the system supports controlled and repeatable deposition processes. (Note: The system status is tracked as “In operation”.)

Purpose / Output
• Thin-film deposition via PVD sputtering
• Surface functionalization and process development using metal and dielectric targets
• Control of film properties via RF or DC substrate bias
• Improved coating uniformity using substrate heating/cooling and rotation

Application Areas
• Thin-film deposition steps in micro/nanofabrication (metal/dielectric layers)
• Coatings for sensor and MEMS manufacturing
• Electrode/interlayer deposition for electronic and optoelectronic components
• Surface modification, adhesion layers, and barrier coatings

Highlights
• Compatibility with 4-inch wafers for common cleanroom workflows
• Process flexibility with RF or DC substrate bias
• Controlled deposition with up to 500°C substrate heating, water cooling, and 1–30 rpm rotation

Technical Specifications

Feature Value / Description
Deposition method PVD – Sputtering
Available targets Cu, Cr, Ni, Si, SiO₂, Ti, Ta (and similar)
Base pressure < 5 × 10⁻⁷ Torr
Substrate (wafer) size 4" diameter
Substrate bias RF or DC
Substrate heating Up to 500 °C
Substrate cooling Water cooling
Substrate rotation 1 – 30 rpm
Number of targets Four 2" targets
Control Computer-based automatic control
Usage note In operation

Contact / Service Request
For service requests: you may email [email protected]
. (Please specify the sample type, purpose, and preferred date range.)