Boğaziçi CT3
Device Name / Brand / Model
• Name: Mask Aligner / UV Exposure System
• Brand: ALİGNER
• Model: EVG 620
Overview
The EVG 620 mask aligner enables high-precision alignment and UV exposure for photolithography processes using automated top and bottom optics. The system supports alignment accuracy down to 0.5 µm for top-side alignment and down to 1 µm for bottom-side alignment. Multiple contact and proximity exposure modes provide flexibility to match process requirements. (Note: The system status is tracked as “In operation”.)
Purpose / Output
• Mask-to-wafer alignment for photolithography (top-side / bottom-side)
• UV exposure of photoresist
• High-precision overlay alignment for multi-layer processes, supporting repeatability and process verification
• Flexible exposure options via Soft/Hard/Vacuum contact and Proximity modes
Application Areas
• Photolithography workflows for MEMS and micro/nanofabrication
• Overlay alignment in multi-layer mask processes
• Circuit/microstructure fabrication and prototyping on silicon wafers
• R&D and pilot-scale photolithography processes
Highlights
• High alignment accuracy: 0.5 µm (top side) and 1 µm (bottom side)
• Standard compatibility with up to 100 mm wafers and a 5-inch mask holder
• Flexible exposure modes: Soft, Hard, Vacuum contact, and Proximity
Technical Specifications
| Feature | Value / Description |
|---|---|
| Wafer compatibility | Up to 100 mm silicon wafers |
| Mask holder | 5" mask holder |
| Exposure modes | Soft, Hard, Vacuum contact, Proximity |
| Alignment range | X, Y: ±5 mm; Theta: 3° |
| Alignment accuracy | 0.5 µm (top side), 1 µm (bottom side) |
| UV intensity stability | ±2% (at 100 mm diameter) |
| Lamp intensity | 20–25 mW/cm² |
| Usage note | In operation |
Contact / Service Request
For service requests: you may email [email protected]. (Please specify the sample type, purpose, and preferred date range.)
